Gospell Digital Technology Co.,ltd
GOSPELL FOR BETTER CONNECTIVITY & CONTROL
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Main Features
Technical Specification
| Chipset and Memory | |
| Chipset model | Hi3798MV200 |
| CPU Speed | 2.0GHz @25000DMIPS |
| eMMCFlash | 8GB/16GB |
| RAM | 1GB/2GB |
| Power Supply | |
| Power Supply | DC 12V 1A |
| MaximumPower Consumption | 12W |
| Standby power | ≤ 1W |
| Built-in modules | |
| Bluetooth 4.0 | Optional |
| Interface | |
| RFIN | X1 |
| RF OUT | X1 |
| OPTICAL | X1 |
| AV out | X1 |
| HDMI | X1 |
| ETHERNET | X1 |
| WIFI | X1 |
| USB port | X2(USB 2.0),X1(USB3.0) |
| TF card | X1 |
| Audio Decoding | |
| Compliant with | MPEG-1/2, HE AAC(optional),AC3(optional) |
| Video Decoding | |
| Compliant with | MPEG2 MP@HL,MPEG4 SP@L0-3,ASP@L0-5,H.264 HM@L4.1AVS MP@L6.0 / H.265 Main Profle@l5.0 High-tier,maximum 4K x 2K@60 fps 10-bit decoding |
| Aspect ratio | 4:3/16:9 |
| Video format | PAL/NTSC/SECAM |
| Resolution | 480i/480p/576i/576p/720p/1080i/1080p/4Kx2K@60fps |
| Wireless | |
| Wireless Frequency | 2.4G |
| Wireless Standards | IEEE 801.11 b/g/n , |
| Environmental | |
| Operating Temperature | 0℃～60℃ |
| Storage Temperature | -20℃～50℃ |
| Mechanical | |
| Product Dimensions(W x H x D) | 180mm*110mm*24mm |
| Product Weight | Approx. 0.28Kg |